Viscom has released the S3088 Flex system as an enhanced model to the S3088-III. Like its predecessors, the S3088 Flex is distinguished by a highly effective electronics assembly inspection
Viscom's SPI inspection systems have been equipped with CyberOptics' 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms
Viscom now offers the S3016 inspection system for inspecting electrical assemblies from below. This system is available with 8M camera technology
Viscom has introduced the Q++ package, which is currently being deployed in S3088 and S6056 series machines
Viscom has introduced a closed tube for the inspection system X7056, suitable for high performance applications with short throughput times
Viscom has introduced software release 7.43. The update contains new features and useful additional functions for programming and inspection mode
Viscom has introduced its new vVision touch screen-based user interface for handling inspection systems
Viscom has released the S2088BO-II, a desktop system for automatic optical wirebond inspection
Viscom has introduced its 3D paste inspection system S3088VPI. The 3D technology for paste quality control provides precise measurement technology and offers reliable paste print inspection
Viscom, a manufacturer of wire bond inspection systems, has introduced new software tools for its VHR (Very High Resolution) camera module, which has the ability to provide exact measurements of balls and wedges
The sensor of SWIR Vision Systems' Acuros CQD 1920 camera
Matthew Dale finds that new sensor technologies based on quantum dots are set to bring down the cost of shortwave infrared imaging
Keely Portway finds out how vision technology is playing a role in medical diagnosis
Bob McCurrach, director of standards development at AIA, updates on the progress being made in GigE Vision
Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
