Viscom

Viscom has released the S3088 Flex system as an enhanced model to the S3088-III. Like its predecessors, the S3088 Flex is distinguished by a highly effective electronics assembly inspection

Viscom's SPI inspection systems have been equipped with CyberOptics' 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms

Viscom now offers the S3016 inspection system for inspecting electrical assemblies from below. This system is available with 8M camera technology

Viscom has introduced the Q++ package, which is currently being deployed in S3088 and S6056 series machines

Viscom has introduced a closed tube for the inspection system X7056, suitable for high performance applications with short throughput times

Viscom has introduced software release 7.43. The update contains new features and useful additional functions for programming and inspection mode

Viscom has introduced its new vVision touch screen-based user interface for handling inspection systems

Viscom has released the S2088BO-II, a desktop system for automatic optical wirebond inspection

Viscom has introduced its 3D paste inspection system S3088VPI. The 3D technology for paste quality control provides precise measurement technology and offers reliable paste print inspection

Viscom, a manufacturer of wire bond inspection systems, has introduced new software tools for its VHR (Very High Resolution) camera module, which has the ability to provide exact measurements of balls and wedges