Viscom's SPI inspection systems have been equipped with CyberOptics' 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms.
By integrating a proven high speed advanced 3D SPI sensor into the wide range of capable AOI and AXI systems in Viscom's product portfolio, Viscom is now able to offer superior inspection solutions at every in-line test gate in the electronics assembly process. Viscom's universal software allows the operator to program all systems using the same interface and utilises unique features like the SPI-AOI process uplink. This SPI-AOI or SPI-AXI uplink supports the classification at the AOI test gate by correlating SPI result data with solder joint analysis.
The first available Viscom solution with the CyberOptics SE500 sensor head is the Viscom S3088 SPI.
