The Technical Universities of Braunschweig and Munich have developed a system that enables small aircrafts to land fully automatically using a camera as a positioning sensor
Photonfocus has released the MV4 camera platform with a new sensor, the LUX 1310 from Luxima
The smallest member of the Photonfocus family, the MV0 camera platform (30 x 30mm), has a new feature
Photonfocus sales increased by 23 per cent compared to the previous year
Photonfocus has extended the MV0 series with 2 and 5 megapixel Sony CMOS image sensors
The SWIR camera MV3-D640I-M01-144-G2 with the GigE interface from Photon Focus is constantly being developed further, to better support the realisation of various applications
Hyperspectral Imaging represents a significant growth segment for machine vision. The potential of this relatively young discipline is estimated to be massive for the future
Photonfocus has increased its 3D camera portfolio by two new high speed cameras
Burst Mode, MROI, and Binning are implemented in Photon Focus' high-speed camera MV1-D1280-L01-1280-G2 enabling this camera to fully exploit the sensor speed
In addition to its usual portfolio, at booth 5364 Photonfocus will be presenting cameras with high Fullwell capacity for welding and measuring applications
The sensor of SWIR Vision Systems' Acuros CQD 1920 camera
Matthew Dale finds that new sensor technologies based on quantum dots are set to bring down the cost of shortwave infrared imaging
Keely Portway finds out how vision technology is playing a role in medical diagnosis
Bob McCurrach, director of standards development at AIA, updates on the progress being made in GigE Vision
Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
