Surface-based matching in Halcon, from MVTec Software

Measuring the third dimension

Greg Blackman looks at the latest techniques to capture and analyse 3D image data

The preferred connector for version 2.0 is the micro-BNC. Credit: Active Silicon

CoaXPress v2.0 addresses need for speed

Chris Beynon, Active Silicon’s CTO and technical chair for the CoaXPress standard, gives an update on what’s new in v2.0


Among the exhibitors at Photonics West, Basler (booth 152) will be showing its Ace2 camera series, which includes the Ace2 Basic and Ace2 Pro lines. Both feature CMOS sensors with excellent image quality, optimised hardware design, and are available with GigE and USB 3.0 interfaces.

The Ace2 Basic line is designed for the standard tasks of a vision system, while the Ace2 Pro provides support for more demanding requirements thanks to powerful in-camera features such as Pixel Beyond and Compression Beyond.

AMRC's Integrated Manufacturing Group's work spans robotics and automation, integrated large volume metrology, digital assisted assembly and manufacturing informatics

The sky’s the limit

Greg Blackman visits the University of Sheffield’s Factory 2050 where Rolls-Royce, McLaren and Siemens, among others, are investing in research on digital manufacturing


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