Standards Offshore rig safety improved by 80% with computer vision monitoring, says report AI-based vision monitoring can detect unsafe behaviour at offshore rigs miles from home, says the Journal of Petroleum Technology Latest Content The latest hyperspectral imaging products for 2026 Offshore rig safety improved by 80% with computer vision monitoring, says report Advanced sensing is becoming a tool for “real-time decision-making” New technologies Compact, High-Performance Hyperspectral LED line Light Gidel presents edge computer with NVIDIA Jetson Orin NX system at Embedded World Vision Components presents new MIPI camera modules at Embedded World White papers Enclosures for machine vision cameras Download the technical white paper on machine vision camera enclosure engineering. Learn the physics of thermal dissipation, vibrational stability, and IP67/IP69K sealing. Machine vision beyond the camera: navigating complexity to reach production-ready systems faster This White Paper explores some of the combined approaches using industrial cameras and extensive machine vision software to implement modern image processing systems Machine vision lighting for OEMs: From integration risk to performance enabler This White Paper outlines how OEM machine builders and system integrators can eliminate integration risks and accelerate time-to-market using a structured three-level customisation framework and co-engineering workflow Webcasts NEW | From AI to optical filters: Cut industrial infrared imaging costs On-demand - UK photonics distribution: what manufacturers, startups & OEMs need to know NEW on-demand | The ins and outs of infrared imaging More content Direct communication between FPGAs and GPUs Covid-19; a message to our readers and commercial partners Introduction to Modulation Transfer Function Is vision ready for the cloud? AIA Vision and UKIVA shows cancelled; Intertraffic rescheduled MvBlueFox3-5M camera series DVXplorer Lite Embedded World demos and new sensor modules E-CAM50_CUCRL development board GenICam 2019.11 Helios Flex 3D time-of-flight module Platform for the NXP i.MX 8 processor Pagination Previous page ‹ Previous Page 199 Next page Next ›
