Ams and Qualcomm Technologies have announced intent to build a 3D camera for mobile phone applications
Greg Blackman visited the Embedded World conference and exhibition in Nuremberg, Germany, at the end of February to find vision in abundance
Computing company Qualcomm Technologies has released a family of system-on-chips built for devices incorporating vision technology
Matthew Dale reports from EMVA’s debut Embedded Vision Europe conference in Stuttgart, where deep learning ‘at the edge’ was discussed
Matthew Dale explores Industry 4.0 and machine vision’s role in the connected factories of the future
Surface-based matching in Halcon, from MVTec Software
Greg Blackman looks at the latest techniques to capture and analyse 3D image data
Keely Portway finds out how vision is being used to gather data about consumers
The preferred connector for version 2.0 is the micro-BNC. Credit: Active Silicon
Chris Beynon, Active Silicon’s CTO and technical chair for the CoaXPress standard, gives an update on what’s new in v2.0
Greg Blackman reports on new hyperspectral technology presented at the Photonex show in the UK, and how the imaging technique is being used for forestry and food sorting
