Yates succeeds Jochem Herrmann, who has held the role of EMVA president since 2015 and has decided to step down to spend more time with his family
Greg Blackman reports from the European Machine Vision Association’s business conference, where a panel of industry experts were gathered to give advice on navigating the acquisition process
Stemmer Imaging has signed an agreement with Odos Imaging to distribute Odos' time-of-flight 3D cameras
Messe Stuttgart has issued a call for entries for the Vision Award, the prize for machine vision innovation to be presented at the Vision trade fair in Stuttgart in November
Rockwell Automation has acquired 3D time-of-flight company Odos Imaging
Matthew Dale explores how 3D cameras are granting robots the gift of sight
While imaging at high speed used to require a dedicated camera, now - with the advances in CMOS technology - machine vision in general is getting faster, as Greg Blackman discovers
Following Odos Imaging winning the Vision Award, Greg Blackman, in the second part of his report from the Vision trade fair in Stuttgart, examines the 3D imaging technology on display
Messe Stuttgart has announced the shortlist for this year's Vision Award, with six entries making the final cut
CEO, Odos Imaging
The sensor of SWIR Vision Systems' Acuros CQD 1920 camera
Matthew Dale finds that new sensor technologies based on quantum dots are set to bring down the cost of shortwave infrared imaging
Keely Portway finds out how vision technology is playing a role in medical diagnosis
Bob McCurrach, director of standards development at AIA, updates on the progress being made in GigE Vision
Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
