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Basler to show processing kit at Embedded World

As last year, Basler is relying on cooperation with strong partners such as NXP, NVIDIA and Amazon Web Services at embedded world 2021 DIGITAL to simplify the path to the final embedded vision solution for customers. The highlight at the trade show, which will be held purely digitally from March 1 to 5, is a processing kit that rethinks embedded vision: the board, developed in-house by Basler, is optimized for a wide range of vision applications in terms of both hardware and software. Due to its design developed for industrial use, the kit can be used not only for prototyping, but also in series production. With the Embedded Vision Processing Kit, developers can thus obtain ready-to-use vision solutions very quickly.

For the i.MX 8M Plus SoC from NXP, which will be available in mid-March, Basler has developed a high-performance vision system for machine learning (ML) applications that features a particularly lean architecture: Basler's specially designed dart communicates seamlessly with the ISP (Image Signal Processor) while providing real-time image processing.

Basler has created additional software interfaces for NVIDIA's Jetson edge computing platform: Now, as a standard, the two 5 and 13 MP Add-on Camera Kits are not only compatible with the Jetson Nano, but also with the more powerful Jetson Xavier NX. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board in addition to the camera and offer the most cost-effective prototyping approach.

Furthermore, Basler will present its cooperation activities with Amazon Web Services at the show. Basler and AWS will work together in the future as a "Go-To-Market Partner" regarding the AWS services Amazon Lookout for Vision and AWS Panorama.

Basler is also represented on the digital presentation channels: At the Embedded World Conference, twice at the Embedded World Forum, and also at the Expert Panel "Embedded Vision: success factors for generating customer value", to which Basler CMO Arndt Bake was invited on the initiative of the German Engineering Federation.


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