This article provides an overview and comparison of the next generation of the Ethernet, USB, Camera Link, and CoaXpress standards, and introduces Thunderbolt3 as an interface to watch. These camera interfaces have helped to shape the growth of the machine vision industry and will continue to do so into the future.
The next generation of high-performance CMOS sensors will open the door to exciting new vision applications, but taking advantage of them will depend on whether your interface can keep up. Ethernet and USB interfaces are increasing their transfer rates to 10Gb/s, adding to the strengths that make them dominant camera interfaces. What are these new technologies and are they ready for machine vision use?
Greg Blackman on the advances being made in machine vision cabling solutions, including the technology that forms the basis of the Camera Link HS interface standard
Carlton Heard at National Instruments says USB3 Vision, the new machine vision standard based on USB 3.0, can only lead to more industrial cameras embedded in machinery. And, he says, its uptake could be faster than all other vision standards that have come before it
Warren Clark speaks to Intercon 1, a company with 25 years' experience in machine vision cabling
The buzz at last year's Vision show in Stuttgart concerned USB3 Vision, a new machine vision standard based on USB 3.0. Greg Blackman looks at how it will fit into the connectivity landscape
Alysium-Tech has carved a niche in the supply of digital cable, meeting the needs of machine vision and more, as Warren Clark discovers
With the recent release of CoaXPress and the planned release of Camera Link HS later in the year, Greg Blackman explores how these two new standards will fit into the machine vision connectivity landscape
Stephen Mounsey takes a look at some of the new imaging connectivity protocols due for release later this year
The sensor of SWIR Vision Systems' Acuros CQD 1920 camera
Matthew Dale finds that new sensor technologies based on quantum dots are set to bring down the cost of shortwave infrared imaging
Keely Portway finds out how vision technology is playing a role in medical diagnosis
Bob McCurrach, director of standards development at AIA, updates on the progress being made in GigE Vision
Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
