This article provides an overview and comparison of the next generation of the Ethernet, USB, Camera Link, and CoaXpress standards, and introduces Thunderbolt3 as an interface to watch. These camera interfaces have helped to shape the growth of the machine vision industry and will continue to do so into the future.
The next generation of high-performance CMOS sensors will open the door to exciting new vision applications, but taking advantage of them will depend on whether your interface can keep up. Ethernet and USB interfaces are increasing their transfer rates to 10Gb/s, adding to the strengths that make them dominant camera interfaces. What are these new technologies and are they ready for machine vision use?
Greg Blackman on the advances being made in machine vision cabling solutions, including the technology that forms the basis of the Camera Link HS interface standard
Carlton Heard at National Instruments says USB3 Vision, the new machine vision standard based on USB 3.0, can only lead to more industrial cameras embedded in machinery. And, he says, its uptake could be faster than all other vision standards that have come before it
Warren Clark speaks to Intercon 1, a company with 25 years' experience in machine vision cabling
The buzz at last year's Vision show in Stuttgart concerned USB3 Vision, a new machine vision standard based on USB 3.0. Greg Blackman looks at how it will fit into the connectivity landscape
Alysium-Tech has carved a niche in the supply of digital cable, meeting the needs of machine vision and more, as Warren Clark discovers
With the recent release of CoaXPress and the planned release of Camera Link HS later in the year, Greg Blackman explores how these two new standards will fit into the machine vision connectivity landscape
Stephen Mounsey takes a look at some of the new imaging connectivity protocols due for release later this year
Greg Blackman reports on CEA Leti's new image sensor, shown at Photonics West, which contains onboard processing and is able to image at 5,500 frames per second
Ron Low, Framos head of sales Americas and APAC, reports from Framos Tech Days at Photonics West in San Francisco where Sony Japan representatives presented image sensor roadmap updates
Ahead of the Control trade fair in May, Greg Blackman speaks to Fraunhofer IPM about three new systems it will present for quality inspection
Greg Blackman speaks to Sofradir about its €150 million investment to advance infrared sensor technology
