The new x|act inspection software from GE's Inspection Technologies business is now available for the company's Phoenix Microme|x and Nanome|x 180kV high-resolution X-ray inspection systems. This powerful imaging package replaces the existing Phoenix quality|assurance software and finds application in manual inspection of electronic components as well as fully automated, CAD-based, X-ray inspection of solder joints in electronic assemblies.
It is available in three versions: x|act base, x|act operator and x|act pro. All versions offer easier operation than previous packages, allowing more reliable inspection.
Additional software features included in the x|act operator upgrade package include the facility to introduce a live CAD data overlay, automated saving of results, images and X-ray sample maps and CAD- based programming.
In addition to all the features of the first two versions, users who upgrade to x|act pro can enjoy CAD-based image processing and live overview of PCB solder pad information in the X-ray image for easy identification, as well as statistical review based on inspection results and 3D auto-referencing for optimised positioning accuracy to a few micrometres. The inspection results and pad IDs can be viewed in the live image as an overlay at any time and from any viewing angle. This enables quick and precise solder joint mapping even with manual inspection.
To keep programming time to a minimum, x|act operator and x|act pro import the CAD data of the PCB and create a model, which facilitates navigation and also enables inspection strategies to be assigned to the individual components to be inspected. Within x|act pro inspection strategies with all the information required for automatic inspection are contained in the library for many common solder joint types.
Phoenix Nanome|x and Microme|x X-ray inspection systems feature an open 180kV, 15 or 20 Watt nanofocus or microfocus X-ray tube with GE's temperature stabilised DXR detector technology. This ensures brilliant live inspection images at 30fps. 3D computed tomography (CT) scans of small electronic devices are also a possible option for advanced 3D failure analysis tasks.
