Vision China

14 March 2018 to 16 March 2018
Shanghai, China


At booth 5714 BitFlow will be exhibiting some of its latest frame grabbers, including the Cyton-CXP4 with four single-link CoaXPress cameras, and the Aon-CXP, a low-cost single-link CoaXPress frame grabber that supports one CXP-6 camera. The Aon-CXP complements the Cyton CXP family for cameras with one to four links while using the same BitFlow cross interface SDK. 

The Axion-CL, Bitflow’s sixth generation Camera Link frame grabber that combines the power of CoaXPress with the requirements of Camera Link 2.0, will also be shown.

Lastly, Bitflow’s BitBox will be on display, an industrial input/output box driven by high-speed cable connected to a Bitflow frame grabber. The BitBox is compatible with both Bitflow’s Axion-CL and Cyton-CXP frame grabbers.



Euresys’ Coaxlink Octo eight-connection CXP-6 frame grabber that offers a data transfer rate of 5GB/s will be exhibited at booth 5624. It comes with a PCIe Gen 3 x8 bus offering a peak delivery bandwidth of 7.8GB/s. The effective delivery bandwidth is 6.7GB/s. It is also compatible with the Memento Event Logging Tool.

The main target for the new Coaxlink Octo is multi-camera applications, with support for up to eight cameras on a single frame grabber/single slot. Successful Coaxlink applications include 3D AOI, FPD inspection, printing inspection and in-vehicle video transfer.


LMI Technologies

LMI Technologies will present a powerful line-up of Gocator 3D smart sensors. On booth 5523 there will be interactive sensor playgrounds and live demos of high-speed, high-resolution line profilers scanning 3C battery weldings, CG glass covers and small electronic components.

Additional demos include Gocator 3D snapshot sensors in critical automotive and CE applications, and high-sensitivity 2430 and 2440 smart sensors for rubber and tyre scanning. Gocator robot-integrated applications and multi-sensor networks will also feature prominently in the introduction to FactorySmart offered at LMI’s booth.


Pleora will be showcasing its portfolio of video interfaces at booth 5533, including its new GigE Vision over Nbase-T embedded video interface platform.

The Iport NTx-NBT video interface helps manufacturers meet increasing bandwidth demands for advanced imaging applications while achieving significant cost and design advantages. The video interface transmits uncompressed GigE Vision-compliant images at speeds up to 5Gb/s over extended-reach, inexpensive Cat 5e cabling. Integrated support for the IEEE 1588 Precision Time Protocol is included to synchronise image capture and imaging system elements, while an onboard programmable logic controller lets users control external machines, make functional changes, adjust timing, or add features without requiring new hardware.

Customers are now designing Pleora’s GigE Vision over Nbase-T embedded hardware into x-ray flat panel detectors, cameras, and other imaging devices.


Teledyne e2v

At booth 5100, Teledyne e2v will be exhibiting a range of high performance imaging solutions, including a new 3D sensor for time-of-flight or laser triangulation, and a new Emerald 16M/8M CMOS image sensor featuring small true global shutter pixels aimed at industrial applications. The firm will also present its newest generation of trilinear line scan cameras, as well as those featuring the new Nbase-T frame grabber-less interface.


VRmagic Imaging

VRmagic Imaging will present the LineScan3D at booth 2352, a 3D sensor with a field of view of 74mm width and 76mm height at a sub-pixel resolution in the area of 1.5μm. This version of the GigE-Vision compatible 3D sensor is especially fitted for automatic optical inspection of printed circuit boards.

With an integrated laser, optics, protective circuitry and a GigE-Vision interface, the LineScan3D is housed in robust IP65/67 aluminium, has a 24V power supply and an isolated RS485 interface for ABZ rotary encoder input and trigger. Multi-sensor setups can also be realised without additional hardware with the LineScan3D.

Real time extraction of the laser line is carried out in the FPGA of the sensor at 1,000Hz and with an area of interest of 360 lines and 2,048 points per profile. The extraction algorithm is configurable and can be adapted to suit particular applications. An optional high dynamic range (HDR) mode further enhances the laser line extraction for materials with varying surface reflectivity characteristics.

In addition to the 3D range map, the sensor also supplies the brightness values of the laser line, the so-called intensity image. This grey value image enables efficient 2D image processing in parallel to the 3D measurement, e.g. for surface inspection or object identification via bar codes. The extracted 3D profiles and 2D image data are recorded at the same time and from exactly the same perspective – this provides optimum preconditions for combined evaluation.


Greg Blackman explores the latest advances made in scientific CMOS sensors and asks whether CCDs still have a place in life science imaging


Denis Bulgin speaks to Mark Williamson and David Hearn, who both started their own vision companies in the UK 20 years ago and are both now at Stemmer Imaging


Matthew Dale investigates a new class of highly-efficient image sensor that’s just starting to find its way onto the commercial market, all based on the principles of biological sight


Andrew Williams on the uses and current state of hyperspectral imaging, along with the technique’s potential as an industrial inspection tool


Stemmer Imaging’s series of technology days included talks from various lens manufacturers. Here, we round up some of what was discussed at the event


Greg Blackman charts the meteoric rise of Chinese firm Hikvision, one of the top suppliers of video surveillance equipment that has now turned its sights on industrial vision