Teledyne Dalsa, Teledyne e2v, and Teledyne Lumenera will exhibit as Teledyne Imaging at the International Technical Exhibition on Imaging Technology and Equipment (ITE) 2019, 4-6 December in Yokohama, Japan
Teledyne e2v has released its Bora time-of-flight CMOS image sensor
Teledyne Imaging has introduced the newest models in its Genie Nano Camera Link series, the CL M4160 and C4160
Teledyne e2v’s Flash sensor
Teledyne e2v has launched its Flash CMOS sensor family for 3D laser profiling, while Omnivision Technologies introduced a global shutter sensor with 2.2µm pixels
Teledyne e2v has released the Emerald 67M image sensor, designed for ultra-high resolution electronics inspection, high-end surveillance and microscopy
Teledyne e2v, Teledyne Dalsa and Teledyne Princeton Instruments have opened a combined office space in Ikebukuro, Tokyo
Teledyne Dalsa, and Teledyne e2v will exhibit their industrial vision solutions in booth 7938. Aligned within the Teledyne Imaging group of companies, the two will showcase a broad range of products targeted at logistics, robotics and packaging applications, including the Snappy 2M barcode sensor, the new Z-Trak 3D laser profiler, the Boa Spot XL smart camera, and an AI robotic arm featuring Sherlock 8.
Teledyne Technologies has acquired the scientific imaging businesses of Roper Technologies, including Princeton Instruments, Photometrics and Lumenera, for $225 million
Teledyne e2v has expanded its Emerald family of CMOS image sensors with a new 5 megapixel device
Stemmer Imaging is now marketing the Teledyne e2v high-performance line scan camera portfolio
The sensor of SWIR Vision Systems' Acuros CQD 1920 camera
Matthew Dale finds that new sensor technologies based on quantum dots are set to bring down the cost of shortwave infrared imaging
Keely Portway finds out how vision technology is playing a role in medical diagnosis
Bob McCurrach, director of standards development at AIA, updates on the progress being made in GigE Vision
Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
