Bora time-of-flight CMOS image sensor
14 November 2019
Teledyne e2v has released its Bora time-of-flight CMOS image sensor
Danny Reed, head of education and skills, PPMA Best, on the charity’s work to increase the number of female engineers
Teledyne e2v
CL M4160 and C4160 Genie Nano Camera Link models
13 September 2019
Teledyne Imaging has introduced the newest models in its Genie Nano Camera Link series, the CL M4160 and C4160
Teledyne e2v’s Flash sensor
New 3D sensor from e2v; Omnivision shrinks global shutter pixels
3 September 2019
Teledyne e2v has launched its Flash CMOS sensor family for 3D laser profiling, while Omnivision Technologies introduced a global shutter sensor with 2.2µm pixels
Emerald 67M image sensor
24 June 2019
Teledyne e2v has released the Emerald 67M image sensor, designed for ultra-high resolution electronics inspection, high-end surveillance and microscopy
Teledyne Imaging opens Tokyo office
20 May 2019
Teledyne e2v, Teledyne Dalsa and Teledyne Princeton Instruments have opened a combined office space in Ikebukuro, Tokyo
Teledyne Imaging
Teledyne Dalsa, and Teledyne e2v will exhibit their industrial vision solutions in booth 7938. Aligned within the Teledyne Imaging group of companies, the two will showcase a broad range of products targeted at logistics, robotics and packaging applications, including the Snappy 2M barcode sensor, the new Z-Trak 3D laser profiler, the Boa Spot XL smart camera, and an AI robotic arm featuring Sherlock 8.
Teledyne buys Princeton, Photometrics and Lumenera
3 January 2019
Teledyne Technologies has acquired the scientific imaging businesses of Roper Technologies, including Princeton Instruments, Photometrics and Lumenera, for $225 million
Emerald 5 megapixel
12 December 2018
Teledyne e2v has expanded its Emerald family of CMOS image sensors with a new 5 megapixel device
Uniiqa+ and Eliixa+ multiline CMOS cameras
26 October 2018
Stemmer Imaging is now marketing the Teledyne e2v high-performance line scan camera portfolio
Emerald 8M9
15 October 2018
Emerald 8M9 features a small, 2.8µm low-noise global shutter pixel and differentiates and provides a high 8.9-megapixel resolution within a compact 2/3 inch optical format
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Dominique Bonnisseau and Corinne Tsamba from Tematys advise on the questions technology firms should ask in order to grow their business
AMRC's Integrated Manufacturing Group's work spans robotics and automation, integrated large volume metrology, digital assisted assembly and manufacturing informatics
Greg Blackman visits the University of Sheffield’s Factory 2050 where Rolls-Royce, McLaren and Siemens, among others, are investing in research on digital manufacturing
Greg Blackman asks machine vision firms what strategies they employ when hiring staff
GenDC modular model decoupling data encoding or decoding from its transmission
Stéphane Maurice, GenICam vice chair and director of software development at Matrox Imaging, describes the benefits of GenDC, the latest member of the GenICam standard family
Wolfgang Pomrehn, collaborative robotics product manager at Bosch Rexroth, says deep learning could reduce the engineering effort of introducing new products to a manufacturing line by three quarters
