The panel discussion at the Embedded World trade fair
Matthew Dale looks at what it will take to increase the adoption of embedded vision
NXP Semiconductors has announced its lead partnership with Arm for Ethos-U55 microNPU (neural processing unit), a machine learning accelerator targeted at resource-constrained industrial and IoT edge devices
Image: Nordroden/shutterstock.com
Greg Blackman reports on a presentation Eric Camirand of Waste Robotics gave about hyperspectral imaging and robotics used in recycling plants
Both Saccade Vision and Tridimeo are targeting the automotive sector with their 3D vision cameras. Credit: Supergenijalac/Shutterstock.com
Greg Blackman speaks to two young companies with some novel 3D imaging approaches
Electronics quality checks made using laser triangulation. Credit: Sick
We ask four experts to give their advice for 3D imaging best practices
A 3D point cloud of a coin, which has metallic, glossy surfaces and a really fine surface structure. Credit: AIT
Matthew Dale investigates the technology behind inline computational imaging
Intergro Technologies has several patents in machine vision. Credit: Intergro Technologies
Keely Portway finds out how vision systems can be more tightly integrated within factory machinery
Credit: Messe Stuttgart
Here’s some of what to expect when the trade fair opens its doors
The Austrian Institute of Technology's 3D surface scanner. Credit: AIT Austrian Institute of Technology
The Austrian Institute of Technology, HD Vision Systems, Prophesee and Zeiss have been recognised by the judges, with the award to be presented at Vision in Stuttgart
