Wafer-scale, hybridised semiconductors to be created for U.S. DoD

PIRT's plans for wafer-sized semiconductor materials will support the U.S DoD's development of next-generation visible and infrared focal plane arrays (Image: Wright-Patterson AFB)
Princeton Infrared Technologies has announced it has been selected by the U.S. Air Force for a Phase II SBIR contract where it will developed concepts for semiconductor materials at wafer level.

Register for FREE to keep reading
Join 10,000+ vision professionals driving innovation in automation, AI and imaging with:
- Expert insights on vision, robotics, AI & embedded tech
- Newsletters and features covering the full imaging landscape
- Visionaries series: leadership strategies in imaging
- Free panels on smart manufacturing & autonomy
- White Papers & updates for smarter integration
Sign up now
Already a member? Log in here
Your data is protected under our privacy policy.
