Teledyne FLIR OEM launches thermal imaging dev kit at DSEI UK
The Boson+ IQ Development Kit is on display at the Teledyne FLIR stand (#S3-110) during DSEI UK 2025, held at ExCeL London from 9 to 12 September (Image: Teledyne FLIR OEM)
Combining thermal imaging with edge AI via Qualcomm’s Dragonwing SoC, Teledyne FLIR OEM’s Boson+ IQ Development Kit launched at DSEI UK 2025
Register for FREE to keep reading
Join 10,000+ vision professionals driving innovation in automation, AI and imaging with:
- Expert insights on vision, robotics, AI & embedded tech
- Newsletters and features covering the full imaging landscape
- Visionaries series: leadership strategies in imaging
- Free panels on smart manufacturing & autonomy
- White Papers & updates for smarter integration
Sign up now
Already a member? Log in here
Your data is protected under our privacy policy.
