MIPI CSI-2 extension chipset
THine®, the leader in high-speed serial interfaces and image signal processing, today announced the high-volume availability of their new MIPI CSI-2 extension chipset, THCV241A and THCV242.
This new chipset allows engineers to extend MIPI CSI-2 transmission from 1 foot to over 15 meters!
These exciting new video chips also enable designs that can receive 2 different video inputs simultaneously, as well as applications that can copy and distribute (simultaneously replicate) 1 video stream into 2.
Demands for higher resolution and/or higher frame rate cameras require MIPI CSI-2 output, which are limited to a short transmission range of approximately 1 foot. THCV241A serializes up to 4 lanes of MIPI CSI-2 signals and converts it into 1 or 2 lanes of V-by-One® HS (developed and owned by THine).
V-by-One® HS technology supports up to 4 Gbps per lane which is robust enough to extend the transmission of 1080p60 2Mpixel uncompressed video for greater than 15 meters with typical cables. THCV241A’s 2 lanes of V-by-One® HS supports up to an 8 Gbps data rate with the capability to use the second V-by-One® HS lane to support data copy and distribution (replication) applications.
The THCV242 chip deserializes up to 2 V-by-One® HS lanes back to the original MIPI CSI-2 signal.
The chipset supports “Sub-Link” that aggregates bidirectional low speed signals, such as GPIO. The separation of high speed signal path, V-by-One® HS, and Sub-Link enables easy debugging and gives more choices for physical harnesses including the utilization of Keyssa®’s contactless connection for systems benefiting from or requiring a ruggedized, low latency, detachable camera (http://www.cel.com/pdf/press/cel_thine_01032019.pdf).
Mirrored video signal redundancy that is supported by this chipset can be used for troubleshooting system problems or for applications such as agricultural robotics and 3D surgical equipment which require a secondary application processor that is distant from the source video camera. Also, any applications that require cameras far from host processors can utilize the features of this chipset.
“This chipset will give more freedom to designers for leading edge technologies, such as Autonomous and 3D visualizing,” said Tak Iizuka, Chief Solution Architect of THine. “The capability to support 2 V-by-One® HS inputs enable new and exciting dual camera applications, like 3D recognition and XR devices that usually require multiple cameras.”
Yasuhiro Takada, CEO of THine, said “We are excited to announce this new chipset because this enables our customers to bring products to market faster, and also gives them the ability to develop new types of applications with a variety of form factors that were not previously possible.”
The chipset is now available through major distributors, including Digi-Key.