Framos's Daria Scheel speaks about the specific opportunities and challenges in the Russian market for vision
From left: Dr Christopher Scheubel, Patrick Bilic, and Dr Andreas Franz
The Cubemos entity focuses on deep learning and AI development, helping industrial customers to integrate AI vision solutions
MVDK evaluation board with MIPI CSI-2 sensor and CXP interface board. Credit: Euresys
Greg Blackman finds that purchasing IP cores for FPGAs is one way to reduce time-to-market for camera production
Alveo U50 accelerator card
Xilinx will be exhibiting its Alveo accelerator cards, the latest release being the Alveo U50, along with a new software platform called Vitis that takes a customer’s AI model and optimises it for the firm's SoCs
On Semiconductor has expanded its high-performance XGS family of global shutter CMOS image sensors with two new models: the XGS 9400 and the XGS 8000
Sony Semiconductor Solutions has launched a new image sensor for surveillance cameras, factory automation applications, and industrial environments. It is available from Framos
Join Dr Christopher Scheubel from Framos and Miro Mlejnek from Intel as they explore the benefits of the Framos D435e camera, featuring Intel’s RealSense technology for industrial environments. Scheubel and Mlejnek will delve deep into the technical specifications and performance of this industrial 3D camera. In addition, this webinar will feature Intel’s RealSense roadmap for off-the-shelf 3D cameras.
Framos AI is launching its FAIM SDK to enable AI powered algorithms optimised for real-time applications
Framos has developed an industrial grade version of Intel’s RealSense Suite to provide Gigabit Ethernet connectivity and an IP66 rated housing
This practical seminar will be taken by Professor Dr Albert Theuwissen, and is aimed at technical imaging experts and engineers.
Matthew Dale explores Industry 4.0 and machine vision’s role in the connected factories of the future
Surface-based matching in Halcon, from MVTec Software
Greg Blackman looks at the latest techniques to capture and analyse 3D image data
Keely Portway finds out how vision is being used to gather data about consumers
The preferred connector for version 2.0 is the micro-BNC. Credit: Active Silicon
Chris Beynon, Active Silicon’s CTO and technical chair for the CoaXPress standard, gives an update on what’s new in v2.0
Greg Blackman reports on new hyperspectral technology presented at the Photonex show in the UK, and how the imaging technique is being used for forestry and food sorting
