Eric Bourbonnais from Teledyne Dalsa has been appointed chair of the GigE Vision standard committee. Bourbonnais takes over from Eric Carey, also of Teledyne Dalsa, who steps down after 10 years of leading the GigE Vision committee.
Bourbonnais took up the post at the Fall 2017 International Vision Standards Meeting (IVSM), which was hosted by JIIA in Hiroshima, Japan during the week of 16 October 2017.
GigE Vision version 2.1 has a release date set for July 2018, while version 2.2 is planned for release in the second half of 2018. Version 2.2 will have GigE Vision Control Protocol (GVCP) improvements for uploading to devices, as well as GenDC support.
The GigE Vision accessory programme titled ‘Certified to use in GigE Vision systems’ is now in place to register products that have been designed to supplement GigE Vision devices but do not implement the full GigE Vision standard. For instance, this could be a Power-over-Ethernet switch that offers locking connectors compatible with GigE Vision cameras.
Elsewhere, Camera Link version 2.1 is coming up, which will: clarify HDR/SDR standoff requirements; skew budget for Channel Link signals; give new high bit depth definitions; allow Camera Link on FPGA implementations with verification; offer an improved pin assignment chart; have a new CL Serial Read function; and offer various corrections for clarity.
The technical committee continues to pursue Camera Link 3.0 to formalise Camera Link on FPGA requirements and testing, and basic GenICam functionality, CRC error detection and device discovery.
Work continues on Camera Link HS revision 2, which will give GenDC support including that for 3D data and multiple areas of interest, and be able to measure propagation delays allowing distances greater than 300 metres over fibre.
USB3 Vision version 1.1 has a target release date of the first half of 2018. It will give multi-stream support, adds USB 3.2 compatibility (multi-lane 10/20Gbit operation), and updates cable specification including cable compliance testing details.
The Spring 2018 IVSM will be hosted by Silicon Software and VDMA in Frankfurt, Germany from 14 May 2018, while the Fall 2018 IVSM will be hosted by National Instruments and AIA in Austin, Texas, USA during the week of 17 September 2018.
AIA’s PlugFests for 2018 are planned at the following venues: Boston Vision Show, 9am-3pm, 13 April 2018; Frankfurt IVSM, 14 May 2018; and Vision 2018 in Stuttgart, 9am-3pm, 9 November.