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06 November 2018 to 08 November 2018
Stuttgart, Germany

World's leading trade fair for machine vision.

Messe Stuttgart

Active Silicon

Active Silicon (1H52) will present its Vision Processing Unit, an embedded computer designed for use in industrial or medical OEM applications. The product will be demonstrated running with live acquisition from four USB3 Vision cameras.

The company will showcase its latest Camera Link and CoaXPress frame grabbers including the new four-link CXP-12 CoaXPress frame grabber and cost-optimised one-link boards. Also on display will be the Harrier series, a camera interface board family which fits neatly onto Tamron, Sony and other auto-focus zoom cameras to enable real-time, high-definition digital video transmission over long cable lengths.



Aria, a USB3 board-level camera from Alkeria (1C26), will be introduced at the show. The camera, which weighs 5 grams, has on-board image processing, I/O interfaces, and a wide choice of image sensors including Teledyne e2v Sapphire and Ruby sensors, and Sony’s Pregius IMX sensors. The cameras can reach 520fps frame rate.

Aria is available with colour, monochrome, or NIR-enhance CMOS sensors, and 8-, 10-, and 12-bit analogue-to-digital conversion; it is equipped with Windows and Linux SDK and various code samples in C++ and C#. A C-mount or S-mount optional lens adapter is available, and the camera offers customer-specific operation porting and on-board pre-processing.


Allied Vision

Allied Vision (1D30) will present its new Alvium camera series. With extensive functions for image correction and optimisation, a large selection of current sensors, intelligent energy management, and cost-optimised design, the new camera series combines the advantages of classic machine vision cameras with the advantages of embedded sensor modules. It opens up new ways for users to switch from PC-based image processing applications to embedded systems. Several live demonstrations running on different embedded boards will show cameras of the Alvium series in action.

Allied Vision's new high-speed camera family Bonito Pro, which has a CoaXPress interface and was specially designed for applications with high bandwidth requirements, will also be exhibited. Equipped with four DIN 1.0/2.3 connectors, the cameras can transmit 25Gb/s via the CXP-6 high-speed connections. The new camera will be on display at the booth as part of a PCB inspection application.

Allied Vision will also be previewing the new 50 megapixel camera Prosilica GT10000 with the KAI-50140 large-format CCD sensor from On Semiconductor. The sensor has a resolution of 10,440 × 4,800 pixels. The 2:1 aspect ratio makes the camera particularly suitable for display inspection, aerial photography, and optical metrology.

Lastly, the Mako G-508 POL, equipped with a 5.0 megapixel IMX250MZR/MYR CMOS polarisation sensor from Sony, will be on display.


Automation Technology

Automation Technology (1F54) will present its IRSX series of smart infrared cameras, designed for industrial use. Designed as an all-in-one solution, the IRSX cameras combine a calibrated thermal imaging sensor with a powerful data processing unit and a variety of industrial interfaces in a small, rugged IP67 housing. The cameras offer various protocols, including GigE Vision, Modbus TCP, HTTPS and FTP.

A comprehensive range of software tools supports the integration and use of the cameras. Standard APIs such as REST, GigE Vision, MQTT and OPC-UA, and a number of application-specific apps are included.

Also on display will be the company’s C5-CS series of high-speed 3D sensors. There are four additions to the series, all of which support an output of up to 1,280 points per profile and achieve a frame rate of up to 200kHz. The 3D technology is combined with high-end laser electronics in an IP67 housing.

Finally, the MCS series of high-speed 3D sensors will be shown, where the field of view, resolution and frame rate can be customised.


Basler (1E42) will show technology that addresses the availability of new interfaces and new sensor generations while meeting the market demand for higher resolution and higher frame rates. There will be new models from the Ace camera series, including the model that was developed as a 1: 1 replacement for Sony's discontinued CCD sensor ICX618. Basler will also introduce four 20 megapixel Ace U models based on the Sony Pregius IMX183.

Another highlight will be the embedded vision development kit consisting of: Qualcomm's Arm-based system-on-chip with integrated Image Signal Processor, the Snapdragon 820; the Basler Dart 5 megapixel camera module with Bcon for MIPI interface; and the Pylon camera software suite for Linux operating system. A live presentation, implemented with Basler's time-of-flight camera, will demonstrate cost-optimised system integration with embedded vision.

In addition, there will be new accessories on display, as well as a unique concept in the field of lighting, centred on maximising customer value.



BitFlow (1A06) will be highlighting its CoaXPress expertise with multiple demos. The company’s Cyton-CXP4 and Aon-CXP frame grabbers will be showcased, as well as a newly developed CXP12 product.



CCS (1H53) returns to Vision Stuttgart with high-performance developments in core illumination technology, as well as in integration of lighting and real-time lighting data. The new OLED series flat lights are 3mm thick yet provide the brightness and uniformity required for applications like liquid level inspection and dimension measuring. The dedicated OLED controller from Gardasoft features CCS LT for lifetime intelligence data and precision control for accuracy, stability and safe overdrive.

Fastus intelligent lighting guarantees lighting intensity and integrates with GenICam for Industry 4.0 maintenance and performance data. CCS will also show plug-and-play developments, featuring camera synchronisation and easy strobing and overdrive; precision dome line lights; and laser box lighting.

Other developments include new core LED lighting products that feature improved brightness and uniformity. This includes the LFVX series flat dome lights, the FPQ3 series low-angle square lights, and the HLV3 series spot lights. One noteworthy demo will be the LSS series computational illumination showing photometric stereo with motion compensation.


The Crowley Company

The Crowley Company (1F84) will be exhibiting the next generation of its Machcam 71, a 71 megapixel area array camera. The camera is based on a CHR70M sensor and is suitable for applications including LCD and PCB inspection, aerial imaging, packaging and inspection, scientific imaging, and military and law enforcement security.

The camera is supplied with a Pleora software development kit and is USB 3.0 compatible. It is compatible with Cognex VisionPro and other key machine vision industry software. The 1.5 version of the camera includes an external trigger for enhanced capture options in automated environments, bootloader capability for FPGA firmware updates, and an automated calibration processor for optimal image results, which can vary from sensor to sensor.

Also on show will be a MACHCAM 120MP prototype, which uses Canon’s 120 megapixel image sensor.


Highlights at Euresys’ booth will be demonstrations of the latest CoaXPress frame grabbers, including the Coaxlink Quad CXP-12, a new four-connection 12-Gb/s CoaXPress 2.0 frame grabber. CXP-12 operates at 12.5 Gb/s, twice the speed of the CXP standard. Also on show will be the Coaxlink Octo, an eight-connection CXP-6 frame grabber. Both support CustomLogic, custom on-board FPGA processing for Coaxlink.

The latest two libraries of Open eVision will also be demonstrated: EasyDeepLearning, a convolutional neural network-based image classification library. EasyDeepLearning has been tailored, parametrised and optimised for analysing images, particularly for machine vision applications. EasyDeepLearning has a simple API and the user can benefit from the power of deep learning with only a few lines of code.

Easy3D is a set of software tools to build 3D inspection applications. Easy3D is able to generate a depth map from a series of images that contain a laser line projected on the inspected object and computes a calibration model applied to depth maps to transform them into calibrated 3D point clouds. It provides functions to generate such ZMaps.

Also on display the new Camport video converters. This new generation of video converters makes it possible to update a wide range of existing cameras and other image sources to support the latest vision interface standards. And finally, the HD1 H.265 video server will be shown, which streams video from one Full HD (1080p60 or 1080i60) source over an IP network.

Sensor to Image will be present at Euresys’ booth and will feature its new products.



EVT (1A63) will present the latest features of its EyeVision 3D software. The package contains commands for inspecting glue, adhesive beads, and weld seams, as well as for bin-picking. The core competence of EyeVision 3D is 3D pin inspection for recognising flaw, such as those in the pin height or true point.

EyeVision can now control and communicate with UR robots with only a single command. Robot control and image evaluation can be carried out using EyeVision for tasks such as bin picking or thermal imaging.

EVT will also be displaying its RazerCam ZLS smart line scan camera, with optional Zynq or Myriad 2 deep learning processor. The FPGA is freely programmable under Linux, available with Power over Ethernet (PoE), automatic shading correction and is capable of multi-data streaming. The line scan camera can be also converted into a matrix camera – the RazerCam ZM has a matrix sensor from Sony.

Finally, EVT will show the Saturn laser triangulation sensor with 1kHz resolution. The sensor is available with red and blue laser versions, and is also GenICam compatible.



Framos (1C42) will be highlighting products designed for a modular approach to embedded vision, as well as showing Intel’s RealSense 3D vision product suite. The company will display various technology and sensor modules, including Framos’ SLVS-EC IP core for Xilinx FPGAs. The booth will also include the latest Sony and On Semiconductor sensor solutions, showcasing the new Sony IMX250 polarised sensor to support precise spectral measurements, and On Semiconductor’s latest XGS series.

On 6 November at 10:30am, Intel’s Miro Mjelnek will present on the technical innovations in 3D imaging, followed at 11:30am by Xilinx’s Dave Hitt and Framos’ André Brela, who will speak on: ‘How can future vision systems get increased resolutions, speeds and embedding requirements under control?’


Gardasoft Vision

In addition to the announcement of a new lighting controller, Gardasoft Vision (1E53) will be presenting a number of new demonstrations to illustrate the power of machine vision sequencing and control technologies. These will cover computational imaging, ultrafast focusing, OEM controllers and multi-light line scan stations.

Gardasoft’s RTCC series of lighting controllers will be used to drive a segmented dome light so that a smart camera can acquire a rapid sequence of images under different illumination angles. The camera will use computational imaging software to extract surface detail that cannot be seen using conventional imaging methods.

Three controllers will be in action to demonstrate high-speed focusing on objects of different heights using a liquid lens from Optotune. A CC320 timing controller, positional encoder from a moving platform, camera and RC120 lighting controller will be linked together to give the required camera exposure and illumination needed for imaging. A TR-CL-180 liquid lens controller will be used for high-speed adjustment of the lens for focusing.


IDS Imaging Development Systems

IDS Imaging Development Systems (1F72) will present new models of its vision app-based platform IDS NXT, which allows recurring vision tasks to be set up and changed easily. The new Ensenso XR series with on-board data processing will be shown for the first time. The camera will also be able to transfer 3D data to a control unit via GenICam in the future. Ensenso XR enables new scopes for application design, accurate acquisition of details, and acceleration of data processing.

IDS will also display USB 3.1 Gen 1 board-level industrial cameras with liquid lens control. These cameras facilitate image acquisition at variable object distances as their focus can be readjusted quickly and comfortably via user interface or API. The cameras are available with a 6.4 megapixel rolling shutter sensor from Sony or the highly photosensitive 18.1 megapixel rolling shutter sensor from On Semiconductor. They are equipped with S-mount or CS-/C-mount, twist-proof USB Type-C connection, and practical USB power delivery.


Autonomous machine vision firm, Inspekto (1D81), will launch its quality assurance product. Inspekto produces industrial autonomous machine vision for quality inspection, gating and sorting. The idea behind the company’s Plug and Inspect technology is that employees in a manufacturing facility can take the autonomous machine vision system out of the box and install it in minutes, without help from a systems integrator. Plug and Inspect systems provide full autonomy to the manufacturing plant: systems self-adapt to changes in the environment, such as changes in light conditions and object location or orientation, without intervention.

The system’s machine vision and artificial intelligence capabilities mean that manufacturers can change the object under inspection, or even move the system to another production line, without the need for external experts, according to the company.



JAI (1F50) will demonstrate its prism-based RGB colour line scan camera, the Sweep+ SW-4000T-10GE, based on a backwards compatible 10GBase-T GigE Vision interface delivering 10Gb/s output. The camera is backwards compatible to NBase-T (5Gb/s and 2.5Gb/s) and 1,000Base-T (1Gb/s). With a resolution of 4,096 pixels per channel and a maximum speed more than 100kHz, the camera is designed to cover a wide range of industrial line scan imaging applications.

JAI has added a new high-speed trilinear CMOS colour line scan camera – the SW-4000TL-PMCL – to its Sweep series camera family. It features 4K (4,096 pixels) resolution and a maximum full line rate of 66kHz for 24-bit non-interpolated RGB output. Features include horizontal and vertical binning, built-in colour space conversion functions, as well as direct encoder connection and auto-detection of scan direction.

JAI will also launch a new polarisation area scan camera in the Go series, built around Sony’s 5.1-megapixel IMX250MZR CMOS image sensor with a four-way polarised filter design.


Laser Components

Laser Components (1G31) will present its first Flexpoint line laser module in a square casing, the MVsquare (65 x 15 x 15mm). This latest addition to the Flexpoint MV series was designed for quick and easy installation during series production of 3D systems for industrial image processing. Focus, beam position and all other parameters are aligned during production according to customer specifications.

Upon customer request, the MVsquare will also be available in a space-saving version in which the laser beam is deflected by 90° and exits from the side of the housing. The MV series, including this new module, now includes ten models with a large range of options. Customers can choose between different wavelengths: blue (405nm, 450nm); green (520nm); red (635nm, 660nm, 685nm) and NIR (785nm, 830nm, 850nm). Depending on the laser diode, exit powers of up to 100mW can be reached. In addition to the standard models with adjustable focus, most are also available in low-price versions with fixed focus.

Modules can now be supplied with separated optics and electronics sections, custom built to fit into tight spaces.

LMI Technologies

At this year’s show, LMI Technologies (1C14) will unveil three 3D inspection products. Firstly, a new series of smart 3D line profilers with scanning down to 8µm X resolution, 0.2µm Z repeatability. The profilers offer complete inspection cycles – scan, measurement, and control – at up to 10kHz, all onboard the sensor with no external controllers.

Secondly, the newest member of the LMI snapshot sensor family delivers scanning at 5µm XY resolution and 0.2µm Z repeatability. This technology allows customers to move from traditional laser profiling solutions to a stationary inspection design that reduces cost and complexity.

Finally, LMI’s vision accelerator is a compact, plug-and-play device. It is a cost-effective solution for adding massive GPU-driven data processing power to any Gocator 3D smart sensor in order to meet inline production speed, without the need for an industrial PC.

Lucid Vision Labs

Lucid Vision Labs (1C62) will introduce two GigE Vision camera families at the trade fair. The Triton camera features active sensor alignment for excellent optical performance. It measure 29 x 29mm and offers IP67 protection for harsh environments, along with M12 Ethernet and M8 GPIO robust connectors. Triton ranges from 0.4-megapixel to 20-megapixel resolution, including the 5 megapixel Sony IMX250MZR/MYR polarised, the 12.3-megapixel IMX304, and 20-megapixel IMX183 sensors.

Also new from Lucid is Atlas, a 5GBase-T PoE camera capable of 600MB/s over standard Ethernet cables up to 100 metres. Measuring 55 x 55mm, the Atlas is equipped with a M35 lens mount that can easily be adapted to F-mount. The first Atlas model features the new 31-megapixel Sony IMX342 APS-C format global shutter CMOS, followed by the 19-megapixel IMX367 and the 16-megapixel IMX387 sensors.

Matrox Imaging

Matrox Imaging (1E17) will be showing Matrox Design Assistant flowchart-based software, including new tools for image classification using deep learning and image registration using photometric stereo. These tools will illustrate inspection and OCR of hard-to-see text.

Paired with this software will be a Matrox Iris GTR smart camera and a Matrox 4Sight GPm vision controller with a GigE Vision camera, demonstrating the extent of platform flexibility. Matrox Rapixo CXP – a CoaXPress 2.0 frame grabber programmed using the Matrox Imaging Library (MIL) software – will conduct high-speed video capture with a CXP area scan camera. The Matrox 4Sight EV6 vision controller will also be on display.

The company will also feature demonstrations highlighting reading of PharmaBraille text, 3D profiling for tyre tread inspection, and verifying ID marks using feature-based OCR.

Matrox Imaging (1E17) will be showing Matrox Design Assistant flowchart-based software, including new tools for image classification using deep learning and image registration using photometric stereo. These tools will illustrate inspection and OCR of hard-to-see text.

Paired with this software will be a Matrox Iris GTR smart camera and a Matrox 4Sight GPm vision controller with a GigE Vision camera, demonstrating the extent of platform flexibility. Matrox Rapixo CXP – a CoaXPress 2.0 frame grabber programmed using the Matrox Imaging Library (MIL) software – will conduct high-speed video capture with a CXP area scan camera. The Matrox 4Sight EV6 vision controller will also be on display.

The company will also feature demonstrations highlighting reading of PharmaBraille text, 3D profiling for tyre tread inspection, and verifying ID marks using feature-based OCR.


Midwest Optical Systems

Midwest Optical Systems (1G53) will showcase optical filters for various applications, including SWIR filters, designed to enhance image quality of InGaAs camera technology, and wire-grid polarisers, effective in both the visible and infrared ranging from 400nm to 2,000nm. Plus, all attendees can enter to win a free FK200 filter kit, which features 10 of the most popular bandpass filters used in machine vision.

Georgy Das, the firm’s technical training manager, will give a presentation on filter technology on 6 November at 11:30am on stage two, 1A75.

MVTec Software

MVTec Software (1E72) will introduce Halcon 18.11 and Merlic 4 software releases. Halcon 18.11 includes new deep learning functionality and expanded embedded vision capabilities. The release also provides new functions for developers.

In a live demo, an UR3e robot arm will be programmed to recognise objects in a crate using Halcon 18.11 deep learning matching technologies. Another demo will show MVTec’s standard machine vision software running on three embedded boards connected to cameras that are analysing a fast-moving object.

There will also be a demo of the HPeek system image for the Raspberry Pi. HPeek is MVTec's license-free benchmarking demo program, which is available free-of-charge and can be used to evaluate Halcon’s performance on Arm-based embedded platforms.

MVTec will also show inspection of reflective surfaces with the aid of deflectometry, whereby reflections of known patterns on the surface are evaluated to locate defects.

Merlic 4 has a new parallelisation feature that is able to run separate tools at the same time. Merlic’s deep learning OCR tool will be shown, as will the integration of a programmable logic controller into vision systems using Merlic.



Omron (1F80) will exhibit its portfolio of machine vision solutions, ranging from components, smart cameras and machine vision systems, to complete embedded solutions.

Through targeted acquisitions and development, Omron has made significant advances in the field of machine vision, including cameras and algorithms from Omron Sentech, the Omron Microscan identification solutions, and image processing developed for robot guidance.

On display will be the FH-V7 series, a modular product range for optical quality control. The camera system is equipped with multi-direction and multi-colour lighting, which is also new from Omron. This system allows software-controlled adjustment of illumination: angle, colour and intensity.

Omron offers individual components using application-specific designs to complete factory automation systems.


Panasonic Industrial Medical Vision

Panasonic Industrial Medical Vision (1G13) will demonstrate a microscopy solution featuring the GP-UH532 4K ultra-HD micro camera. The camera has a tiny, 1/3-inch camera head and can be used in a variety of applications. With 3,840 x 2,160-pixel resolution at 50p/60p, the camera is capable of outputting images at up to 1,600 TV lines. The GP-UH532 features various HDMI and SDI outputs, with 4K/2K simultaneous output. The latest firmware update includes long exposure, WDR image enhancement, binning, and an automatic profile shift function.

Also on show, the 4K surgical image recording system, POVCAM, will be presented. POVCAM incorporates features such as high-definition 4K imagery with further image enhancement provided by a hybrid 5-axis image stabiliser and intelligent zoom. Connectivity is through IP stream and IP control (LAN-terminal), with the device recording on SDXC cards.

These 4K camera systems will be presented among other complete and OEM industrial camera applications.



Photoneo (1I45) will showcase its newly launched PhoXi 3D camera for scanning in rapid motion, at high resolution and high accuracy.

The company will show three exhibits with PhoXi 3D scanners: AI-based quality inspection; automated 3D model creation; and AI-driven AnyPick, for picking almost any type of objects from 1 x 1cm, with a large depth of field, ambient light suppression, and 300-500 picks per hour, ideal for e-commerce and logistics.

In addition, Photoneo’s CEO Jan Zizka will hold a presentation on the PhoXi 3D camera at stage two, 1A75, on 7 November at 9:30 am.



Pleora (1F31) will show its external frame grabbers and embedded video interface products. Pleora frame grabbers are ideal for systems where control and analysis is handled by computing platforms in which traditional PCI frame grabbers are impractical. The company’s embedded video interface products are compact boards that support GigE Vision and USB3 Vision connectivity. Also on display will be Pleora’s EBus SDK, a toolkit that allows developers to produce video applications in short timeframes.


On display at the Phytec booth (1H67) will be the PhyBoard-Nunki embedded imaging kit, which uses the two image processing units of NXP’s i.MX 6 processor. It is designed for embedded applications with multiple cameras, such as intercom systems with video, quality control applications that require a thermal imaging camera and a colour camera, or stereoscopy applications. The two camera ports of the kit can be used via five physical interfaces: two parallel PhyCam.P interfaces, two serial PhyCam-S+ interfaces, and a MIPI camera interface.

The firm will also show its i.MX6 processor, suitable for simple embedded imaging applications in cost-sensitive projects, as well as camera modules with i.MX8 (quad max) processor for high power applications. The new VM-016 1-megapixel camera module with global shutter is designed to take images of fast-moving objects, while the PhyCam-M system will make the MIPI standard usable for industrial applications.


Silicon Software

Silicon Software (1C72) will have a demonstrator showing a high-speed deep learning application on FPGA, detecting six different defects on reflecting metallic surfaces with high accuracy.

The company will present its MicroEnable 5 Marathon DeepVCL, an FPGA-programmable deep learning frame grabber for production. For users of the VisualApplets graphical development environment, the Camera Link board can be used for deep learning inference. The MicroEnable 5 Marathon VCLx with the same computing power can be used for complex VisualApplets solutions.

New CoaXPress frame grabbers and VisualApplets version 3.1 will also be displayed, as well as information about frame grabber hardware it plans to release with next generation interfaces: CXP-12, 10 GigE and NBase-T.

Sony Europe’s Image Sensing Solutions division

Sony Europe’s Image Sensing Solutions division (1C37) will unveil a polarised light module based on its five megapixel GS CMOS device. The polarised camera will be joined by an embedded vision concept camera, a 12-megapixel module based on the Camera Link transmission standard, and a 4K FCB block camera.

Sony will be highlighting several strategic additions to its GS CMOS machine vision cameras, including advanced pre-processing features and new capabilities such as IEEE1588-master-device functionality. In addition, the company has added new transmission standards, launching its first USB 3 module.

Stemmer Imaging

An ‘embedded lab’ and a ‘future lab’ will be the two main areas on Stemmer Imaging’s stand (1E52). Both will feature hands-on demonstrations highlighting machine learning, embedded vision, 3D applications, hyperspectral imaging and Industry 4.0 connectivity. These will all use functionality provided by Stemmer Imaging’s Common Vision Blox machine vision software toolkit.

The CVB Polimago machine learning tool will be shown solving a number of machine learning applications across various industries. Meanwhile, an embedded vision system will show communication between Common Vision Blox and a B&R PLC. All communication between the HMI, motorised controller and the vision system is handled using the CVB OPC UA tool. This allows the vision systems to adopt a common architecture within an OPC UA open standard network and provides platform-independent and OS-independent communications for smart factory applications.

A customer evaluation station for hyperspectral imaging will highlight the latest CVB capabilities for the visualisation of hyperspectral image data cubes and for handling metadata.

Also on show will be the new Ricoh SC-10A human assistance camera system for assembly stations, designed to eliminate errors in manual assembly operations. A set of work instructions can be loaded into the system and displayed on a monitor while the camera scans the work piece. The human operator follows the on-screen assembly instructions and after every action the system compares the result to the correct stored image before the next step can be taken. This reduces errors, helps operators learn new tasks and provides a digital audit trail of all operations.


Teledyne Dalsa

Teledyne Dalsa (1F62) will unveil its first 5GigE area camera, a multi-line CMOS line scan camera, and a multi-array CMOS TDI camera.

Teledyne Dalsa’s new Linea ML 8k and 16k cameras offer high speed and high-resolution mono, colour, and multispectral imaging. Independent start and stop of integration for each array allows versatile illumination configurations in a single scan using pulsed LED lighting technologies.

The Linea HS 16k camera is based on the latest charge domain CMOS TDI technology. The multi-array TDI sensor enables high speed multi-field imaging where brightfield, darkfield, and backlit images can be captured in a single scan. Both Linea ML and HS run at a maximum line rate of 300kHz with a Camera Link HS interface using fibre optic cables.

The company is also expanding its Genie Nano camera series with eight 5 Gigabit Ethernet models. The monochrome and colour 5-Gigabit models offer resolutions from 3.2 megapixels to 12 megapixels, and Teledyne’s TurboDrive technology. These new Genie Nano models feature the 5Gbase-T link speed.


Tichawa Vision

Tichawa Vision (1H42) will present its Diamond contact image sensor (CIS) product family, which has a line rate of up to 1,000 kHz. The sensor has a pixel array with powerful signal pre-processing (correlated double sampling, plus on-chip linearisation) and around 1,000 ADC levels with suffixed serialisers. The sensor also has 17 LVDS drivers, each with 622Mb/s of aggregate data rates of over 10 Gbaud.

At web speeds of 21m/s the CIS achieves a resolution of 1,200dpi. The correlated double sampling gives a dynamic range of 60dB.

The company will also show live demonstrations of VTCIS with integrated white balance, and the VDCIS designed for surface inspection of highly profiled objects, which has a working distance of 60mm and a depth of field of 15mm.


UK Industrial Vision Association

The UK Industrial Vision Association (UKIVA) will have 16 members exhibiting at the trade fair. The UKIVA booth (Hall G, stand 1Z105) will be available for members to hold business meetings. In addition, literature racks will be available on the booth where members can display their own publicity material alongside UKIVA’s Vision in Action publication.

UKIVA members exhibiting at the show are: Allied Vision, Baumer, Cognex, Framos, IDS Imaging Development Systems, Ifm Electronic, Imperx, Matrix Vision, Matrox Imaging, Omron, Scorpion Vision (Tordival), Sick, Sony, Stemmer Imaging, Tamron and Wenglor Sensoric.



Xenics (1G51) will showcase a strong line-up of infrared cameras suitable for integrated systems, product development, high-end research, or end-use applications. On display will be line scan and area scan cameras, while live product demonstrations will show how InGaAs line scan cameras are used in the food and beverage industry.