Genie Nano-CXP 67M and 37M cameras

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Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision, is pleased to announce its new Genie Nano-CXP 67M and 37M cameras based on the Teledyne e2v Emerald color and monochrome sensors.

The newest Genie Nano models are easy-to-use and feature a CoaXPress interface. The cameras are engineered for industrial imaging applications requiring high-speed data transfer, such as industrial automation, electronics manufacturing, packaging inspection, semiconductor inspection, PCB-AOI (Automated Optical Inspection), and general machine vision. Designed for a wider range of operating temperatures (from -20°C to 60°C housing temperature), the cameras can be integrated in harsh environments in imaging systems and increases their long-term reliability.

“With the addition of these higher resolution Genie Nano models, our camera portfolio spans resolutions from 16M to 67M with a CoaXPress 6Gbps interface to deliver the maximum throughput from leading-edge, high-resolution CMOS image sensors,” said Manny Romero, Senior Product Manager at Teledyne DALSA.

The Genie Nano-CXP 67M and 37M cameras are fully integrated with Teledyne DALSA’s Xtium™-CXP and Xtium2™-CXP series high performance frame grabbers, providing both convenience and guaranteed compatibility from a single vendor. The Xtium series frame grabbers are also supported by Sapera LT SDK, an image acquisition and control software development toolkit (SDK) that includes Trigger-to-Image (T2IR) framework for maximum reliability of the image acquisition system.

Key Features:

  • Four new models in 67.1 and 37.7-million-pixel monochrome and color versions
  • Wider range of operating temperatures of -20°C to 60°C (Housing Temperature) increasing camera long-term reliability in harsh environment imaging systems
  • Series supports advanced high-performance camera features in a compact form factor for easy integration
  • All-metal body with 3-year warranty

Virtual event

Teledyne Imaging, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, is pleased to announce it will host a multi-session virtual event November 17-19 to introduce its newest and most innovative imaging solutions. Online sessions led by subject matter experts from across the Teledyne Imaging group will cover topics such as machine learning and AI, extreme high-resolution and high-speed imaging, 3D sensing, non-visible and multi-spectral imaging, and high-volume, low-cost CMOS sensors.

Event agenda:

Tuesday November 17, 2020

9:00 AM (ET) – Clarity at High Speed – Performance Imaging
10:30 AM (ET) – Connection is everything – Camera/Data Interfaces

Wednesday November 18, 2020

9:00 AM (ET) – AI & Embedded Vision – Driving System Innovation
10:30 AM (ET) – New Advances in 3D Sensing

Thursday November 19, 2020

9:00 AM (ET) – Beyond Sight! Non-Visible and Multi-Spectral Imaging
10:30 AM (ET) – Evolving CMOS Sensor Technology

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