EQCO125X40 CoaXPress 2.0 chips
21 August 2020
Microchip Technology's EQCO125X40 family of CoaXPress devices now implements the CXP 2.0 standard, and includes features that streamline machine vision system design
Microchip Technology
Events
Latest issue
Greg Blackman speaks to Imec’s Paweł Malinowski about the institute’s new quantum dot SWIR sensor
Hyperspectral imaging can be used to check for blemishes on food packaging lines. Credit: Brillopak
Matthew Dale finds out how vision is enabling smaller batch sizes to be processed on packaging lines
Vision Components MIPI modules can be connected to various embedded processors, including Nvidia Jetson boards
Greg Blackman examines the effort that goes into creating an embedded vision system
Keely Portway finds out how imaging is helping keep cyclists and pedestrians safe
The UK Industrial Vision Association’s Neil Sandhu and Allan Anderson assess some of the implications of the trade deal between the EU and the UK
Credit: Flir
Dimitrios Damianos and Eric Mounier at Yole Développement examine the market landscape after the $8bn purchase
Dr Chris Yates, director of Vision Ventures, gives his take on Flir's acquisition by Teledyne Technologies
Greg Blackman reports on the views of panellists from AIT, MVTec, Irida Labs, and Xilinx discussing AI and machine vision
Imaging and Machine Vision Europe gathered a panel of experts to discuss uptake of 3D vision in robot automation. Greg Blackman reports on what was said
