The Super Optical Device 3 from Moritex is a high performance unit optimised for vision and inspection applications that require mounted lens and lighting.
Products and Press Releases
Hamamatsu Photonics has introduced the new C10000 TDI (time delay integration) board-level CCD camera that features a high speed, high sensitivity, back-thinned CCD image sensor.
As a result of the increasing need for telecentric lenses with high magnification, Moritex has developed a new micromachine lens, the SOD-10X.
Prosilica has released its highest resolution camera ever. The 16-Megapixel GE4900 runs at 3fps at 4872 x 3248 pixel resolution over a GigE Vision interface.
A new Camera Link PCI Express frame grabber is now part of the Grablink series. The Grablink Express complies with the Base-configuration of the new Camera Link standard 1.2.
JAI has released four new digital progressive scan CCD cameras: CM-140 MCL, CB-140 MCL, CM-200 MCL and CB-200 MCL. They are Mini Camera Link versions of JAI's CV-A1 and CV-A2 cameras.
Multipix has released the new Ascent series from Apogee Instruments. The cooled compact CCD cameras have programmable 16-bit digitisation, up to 20MHz and cooling to 40°C below ambient temperature.
Silicon Software has released a new frame grabber. The microEnable IV-Full x1 supports all Camera Link cameras on the market, and was designed to process huge amounts of image data.
Silicon Software has added around 100 new operators to its VisualApplets software for graphical FPGA programming. Version 1.2 includes extensions of the graphic interface and the functional libraries.
Active Silicon is providing frame grabbers with the new Power over Camera Link (PoCL) interface. The products feature the SafePower protocol, so power is only applied when a compliant camera is connected.
Active Silicon has released a new feature-rich card based on the ETX form factor from Kontron, which provides a much more elegant solution to PC-based embedded systems.
TM Robotics has launched a new Toshiba Machine Scara robot in the UK and European markets. Called the TH250A, it offers improved speed compared to existing robots in the range.
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Latest issue
A glass inspection system must distinguish between flawless and waste products to achieve automotive glass wafers free of optical distortions
Susan Fourtané on the increasing demands being placed on web inspection solutions to achieve zero-defect manufacturing
Automation is the only way for e-commerce and logistics firms to fulfil orders since the dramatic uptick in online shopping brought about by the Covid-19 pandemic
Facing new pressures and demands, logistics operations are calling for adaptable machine vision solutions to drive efficiency, discovers Benjamin Skuse
Luca Verre, Co-founder and CEO of Prophesee, as well as a Photonics100 honoree, highlights how event-based vision is set to revolutionise mobile photography
Luca Verre, Co-founder and CEO of Prophesee, as well as a Photonics100 honoree, highlights how event-based vision is set to revolutionise mobile photography
Left: A semiconductor wafer shown to be opaque to white visible light. Right: the wafer is mostly transparent to SWIR light at a wavelength of 1,200nm, making it a suitable wavelength for semiconductor inspection.
Hunting defects in the soon-to-be trillion-dollar semiconductor industry is big business. Anita Chandran explores the latest wafer inspection technology
