Products and Press Releases

Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views

The factory will handle equipment such as digital cameras for scientific measurement, digital pathology slide scanners, and semiconductor failure analysis systems

Researchers at the INRS Énergie Matériaux Télécommunications Research Centre in Quebec, Canada have developed a 3D profilometry imaging technique using Coaxpress frame grabbers from BitFlow

Teledyne Dalsa's Linea Lite family of line scan cameras are now available, while Teledyne Flir has release new models in its Blackfly S UB3 camera line

NIT has partnered with the French National Research Agency to develop HgTe nanocrystal focal plane arrays

Chromasens has expanded its shortwave Infrared imaging portfolio with the AllPixa SWIR 512 line-scan camera

Communication of EMVA 1288 standard logo and compatibility of data sheets as now requires a new license, and the co-designing terms of the GenICam standard in the working group has been adjusted

JAI has expanded its Go-X series of machine vision cameras to include 24 new global shutter camera models featuring the latest Sony Pregius S CMOS sensors

SVS-Vistek has introduced its Beyond Visible line of expanded wavelength cameras

Ximea has introduced new models in its XiX cameras, which use Sony medium-format BSI sensors with exceptionally high resolution

AMD has announced the Ryzen Embedded R2000 series, mid-range system-on-chip (SoC) processors optimised for a wide range of industrial and robotics systems, machine vision and IoT

Orbbec has begun shipping its line of Femto time-of-flight 3D cameras