Following speaking at Embedded Vision Europe, Pierre Gutierrez, lead machine learning researcher at Scortex, writes about the challenges of deploying deep learning on the factory floor
Takashi Someda, CTO at Hacarus, on the advantages of sparse modelling AI tools
Depth map from the SceneScan. Credit: Nerian Vision
Dr Konstantin Schauwecker, CEO of Nerian Vision, describes the firm’s stereo vision sensor for fast depth perception with FPGAs
Imec says the new production method promises an order of magnitude gain in fabrication throughput and cost compared to processing conventional infrared imagers
Greg Blackman reports on new hyperspectral technology presented at the Photonex show in the UK, and how the imaging technique is being used for forestry and food sorting
Each pixel in Prophesee’s Metavision sensor only activates if it detects a change in the scene – an event – which means low power, latency and data processing requirements
3D sensing company, Outsight, has introduced a 3D semantic camera that combines lidar ranging with hyperspectral material analysis. The camera was introduced at the Autosens conference in Brussels
OmniVision Technologies will be showing an automotive camera module at the AutoSens conference in Brussels from 17 to 19 September, built using OmniVision’s OX03A1Y image sensor with an Arm Mali-C71 image signal processor
Hamamatsu Photonics claims it is the first company to mass produce a mid-infrared detector that doesn’t use mercury and cadmium, which are restricted under the European Commission’s RoHS directive
Teledyne e2v’s Flash sensor
Teledyne e2v has launched its Flash CMOS sensor family for 3D laser profiling, while Omnivision Technologies introduced a global shutter sensor with 2.2µm pixels
Matthew Dale explores Industry 4.0 and machine vision’s role in the connected factories of the future
Surface-based matching in Halcon, from MVTec Software
Greg Blackman looks at the latest techniques to capture and analyse 3D image data
Keely Portway finds out how vision is being used to gather data about consumers
The preferred connector for version 2.0 is the micro-BNC. Credit: Active Silicon
Chris Beynon, Active Silicon’s CTO and technical chair for the CoaXPress standard, gives an update on what’s new in v2.0
Greg Blackman reports on new hyperspectral technology presented at the Photonex show in the UK, and how the imaging technique is being used for forestry and food sorting
