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Framos (1C42) will be highlighting products designed for a modular approach to embedded vision, as well as showing Intel’s RealSense 3D vision product suite. The company will display various technology and sensor modules, including Framos’ SLVS-EC IP core for Xilinx FPGAs. The booth will also include the latest Sony and On Semiconductor sensor solutions, showcasing the new Sony IMX250 polarised sensor to support precise spectral measurements, and On Semiconductor’s latest XGS series.

On 6 November at 10:30am, Intel’s Miro Mjelnek will present on the technical innovations in 3D imaging, followed at 11:30am by Xilinx’s Dave Hitt and Framos’ André Brela, who will speak on: ‘How can future vision systems get increased resolutions, speeds and embedding requirements under control?’